Flux residues, dust films and corrosion products are slow failures: leakage paths, RF detuning, connector resistance rising until something drops out at 2am. Cleaning them off assemblies without damaging components is a parameter problem, not a courage problem.
Misonics systems clean PCB assemblies, connectors and telecom hardware with electronics-appropriate frequency, power and chemistry — proven on sacrificial boards before production ever runs.
Rosin and no-clean residues that trap moisture and create leakage paths.
Conductive contamination across boards and RF hardware.
On connectors and contacts in humid and coastal service.
Residues that undermine coating adhesion.
Rising resistance in connector systems.
Post-solder flux removal and pre-coating cleanliness — at frequencies and powers proven safe for the assembly.
Connector bodies, waveguide components, antenna hardware — restored contact and RF performance.
Radio units, enclosures hardware and site-recovered equipment brought back to service standard.
Bubble collapse at the liquid–metal boundary lifts contamination from passages, galleries and cavities without anything touching the surface. Nothing abrades, nothing embeds, no metal is removed.
The VarioSonic G5 tracks the transducer array as temperature and load shift — conversion efficiency up to 95%.
Eliminates standing-wave hot and cold zones across a loaded basket.
Stored recipes and logged cycles — audit evidence produced as a by-product of running.
Multi-stage filtration and weir oil capture hold results steady as the bath loads.
Most faults identified — many resolved — without a site visit.
Heavy 316 stainless tanks, tested before despatch, every wearing part replaceable.
From manually loaded single-tank units to automated lines — and engineered systems where the catalogue ends.
Electronics cleaning runs higher frequencies, controlled power and low-residue chemistry with clean rinsing and drying — the parameter set is proven on sacrificial assemblies first.
| Component category | Specific parts / assemblies | Compatible materials |
|---|---|---|
| PCBA | Assembled boards, modules | FR4, components, finishes |
| Connectors | Circular, RF, backplane | Plated contacts, housings |
| RF | Waveguides, filters, antennas | Aluminium, silver plate |
| Enclosures | Chassis, heatsinks | Aluminium, plated steel |
| Cable hardware | Terminations, glands | Brass, plated finishes |
Where an application needs validation, we clean sample components in our laboratory, document the result, and specify the machine around the verified process. If ultrasonics is the wrong answer, the trial shows that too, and we will tell you.
In-process degreasing and pre-treatment cleaning across general fabrication and machining.
End-effectors, precision actuators and component cleaning integrated into automated lines.
Die and mould cleaning without dimensional loss — release agents, resin and scale.